IBM 44X2302 | BladeCenter H Midplane Board

Here are the technical specifications for the IBM BladeCenter H Midplane Board:

1. Compatibility: IBM BladeCenter H Chassis
2. Dimensions: 17.4 x 1.1 x 14.1 inches
3. Weight: 3.2 pounds
4. Material: FR4
5. Number of blades supported: 14
6. Number of switch module bays: 2
7. Number of I/O module bays: 2
8. Number of power module bays: 6
9. Number of fan modules: 6
10. Maximum power consumption: 1,500 watts
11. Operating temperature: 10°C to 35°C (50°F to 95°F)
12. Storage temperature: -40°C to 70°C (-40°F to 158°F)

Helpful notes:
1. The IBM BladeCenter H Midplane Board is a critical component of the BladeCenter H Chassis, providing connectivity and power to up to 14 blade servers.
2. This midplane board features multiple bays for switch, I/O, and power modules, allowing for flexible configuration options.
3. The FR4 material used in the construction of this midplane board is a flame-retardant, glass-reinforced epoxy laminate that provides excellent electrical insulation properties.