IBM 00D0055 | I/O Riser Board Assembly for x3860 X6 System

Here are the technical specifications for the IBM I/O Riser Board Assembly for x3860 X6 System:

1. Compatibility: IBM x3860 X6 System
2. Expansion slots: 4 PCIe 3.0 x16 slots
3. Supported devices: Network adapters, RAID controllers, Fibre Channel adapters
4. Form factor: Plug-in card
5. Dimensions (WxDxH): 6.6 in x 16.7 in x 1.2 in
6. Weight: 1.1 lbs
7. Data transfer rate: Up to 8 GT/s per lane
8. Power consumption: 25W maximum
9. Operating temperature: 50°F to 95°F (10°C to 35°C)
10. Storage temperature: -40°F to 140°F (-40°C to 60°C)
11. Humidity: 8% to 85% non-condensing
12. MTBF: 1,000,000 hours

Helpful notes:
1. The IBM I/O Riser Board Assembly is a crucial component for expanding the functionality of your x3860 X6 System.
2. With four PCIe 3.0 x16 slots, this board allows for high-speed data transfer and supports a variety of devices.
3. The compact form factor and low power consumption make this board an efficient and space-saving addition to your system.