IBM 31R3304 | Power Module Black Plastic Filler Tray for BladeCenter H

1. Compatibility: IBM BladeCenter H
2. Material: Plastic
3. Color: Black
4. Dimensions (LxWxH): 14.8 x 2.9 x 0.6 inches
5. Weight: 0.2 lbs
6. Quantity: 1
7. Mount Type: Tool-less
8. RoHS compliance: Yes
9. Operating temperature: 10°C to 35°C (50°F to 95°F)
10. Storage temperature: -40°C to 70°C (-40°F to 158°F)
11. Operating humidity: 8% to 80% non-condensing
12. Storage humidity: 5% to 95% non-condensing

Notes:
1. This filler tray is designed to cover unused power module slots in the IBM BladeCenter H chassis, providing a clean and organized appearance.
2. The tool-less mount design allows for easy installation and removal without the need for additional tools.
3. RoHS compliance ensures that this product is free from hazardous materials, making it an environmentally friendly option.