HP 700524-001 | 3.5-Inch I/O Assembly Module for D3600 Enclosure

Here are the technical specifications for the HP 3.5-Inch Large form Factor LFF I/O Assembly Module for D3600 Enclosure:

1. Compatibility: HP D3600 Enclosure
2. Drive Interface: SAS/SATA
3. Drive Form Factor: 3.5"
4. Hot-Swap Capability: Yes
5. Number of Drive Bays: 12
6. RAID Support: Yes
7. Data Transfer Rate: 6 Gb/s
8. Power Supply: Not included
9. Dimensions (WxDxH): 8.7 in x 17.5 in x 2.2 in
10. Weight: 5.51 lbs
11. LED Indicators: Yes
12. Cooling Fans: 2

Helpful notes:
1. The HP 3.5-Inch Large form Factor LFF I/O Assembly Module for D3600 Enclosure is a great option for expanding storage capacity.
2. This module supports both SAS and SATA drives, providing flexibility for different storage needs.
3. Please note that a power supply is not included with this module and will need to be purchased separately.