HP 708047-001 | Midplane Board Assembly for BladeSystem c7000 Enclosure

1. Compatibility: HP BladeSystem c7000 Enclosure
2. Dimensions: 17.1 x 27.5 x 1.2 inches
3. Weight: 2.2 pounds
4. Material: FR4
5. Layers: 14
6. Power consumption: 100-240V AC, 50-60 Hz, 2.5A
7. Operating temperature: 10°C to 35°C (50°F to 95°F)
8. Storage temperature: -40°C to 70°C (-40°F to 158°F)
9. Humidity: 10% to 90% non-condensing
10. Cooling: Passive
11. Number of slots: 16
12. Redundancy: N+1

Helpful notes:
1. The midplane board assembly is a crucial component of the BladeSystem c7000 Enclosure, as it provides connectivity between the server blades and other components.
2. The 14-layer FR4 material ensures high signal integrity and reliability.
3. The passive cooling system reduces noise and energy consumption, making it an eco-friendly choice.