HP 721120-B21 | Expansion Blade Slot-2 FIO Enablement Kit

Technical Specifications:
1. Compatibility: HP BladeSystem c7000 Enclosure
2. Product Type: Expansion Blade Slot-2 FIO Enablement Kit
3. Dimensions (WxDxH): 5.5 in x 9.8 in x 1.1 in
4. Weight: 0.44 lbs
5. Expansion Slots: 1 x expansion slot
6. Data Transfer Rate: 10 Gbps
7. Designed For: ProLiant BL460c Gen8, BL465c Gen8, BL660c Gen8, WS460c Gen8
8. Interface Type: PCI Express 3.0 x16
9. Supported Devices: Network adapter, host bus adapter, Converged Network Adapter
10. Connector Type: QSFP+
11. Features: Full-height, full-length form-factor, hot-plug module replacement, FIO (Factory Integrated Option) support
12. Operating Temperature: 50°F to 95°F

Helpful Notes:
1. This kit is designed to enable the use of additional expansion cards in the HP BladeSystem c7000 Enclosure.
2. The kit supports various devices, including network adapters, host bus adapters, and Converged Network Adapters.
3. The hot-plug module replacement feature allows for easy installation and maintenance of the expansion cards.