HP 441742-001 | Main Midplane Assembly Board for Blc3000

Technical Specifications:
- Compatibility: HP BladeSystem c3000 Enclosure
- Dimensions (WxDxH): 17.4 in x 14.1 in x 1.2 in
- Weight: 2.2 lbs
- Form Factor: Plug-in module
- Expansion Slots: 6 x expansion slot
- Connectivity Technology: Wired
- Data Link Protocol: Gigabit Ethernet
- Remote Management Protocol: SNMP, Telnet, HTTP, HTTPS
- Features: VLAN support, manageable, IPv6 support, Quality of Service (QoS), Jumbo Frames support
- Compliant Standards: IEEE 802.1Q, IEEE 802.1p, IEEE 802.3x, IEEE 802.3ad (LACP), IEEE 802.3ae, IEEE 802.3aq, IEEE 802.1ab (LLDP)
- Operating Temperature: 32°F to 131°F
- Humidity Range Operating: 10% to 90% (non-condensing)

Helpful Notes:
- The HP Main Midplane Assembly Board is a critical component for the HP BladeSystem c3000 Enclosure.
- With 6 expansion slots and support for VLAN and QoS, this board provides flexibility and control for your network infrastructure.
- The board's remote management capabilities allow for easy monitoring and control of your network from a central location.